Semiconductor Die and Package Test Solutions

 

Chiptest Technologies (CTT) provides a variety of low-cost, parasitic inductance-free test solutions for the purpose of testing bare semiconductor dies having Cu pillas, bumps, or RDL patterns, using its proprietary universal device clamp.  The same concept is applicable for testing QFN devices.

Expertise in 3D packaging, die attach, and 3D packaging technologies are offered in form of consulting. 

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