CTT Chiptest Technologies

3-D Embedded Packaging Technology: Analyzing its needs and challenges

By Lajos Burgyan; Arnold Alderman; Brian Narveson; Ernie parker

IEEE Power Electronics Magazine, December, 2015, pp.  30-39

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The Role of Patents in Great Designs: Maximize  Rewards to Assignee and Inventor

By Lajos (Louis) Burgyan; Yuji Kakizaki

IEEE Applied Power Electronics Conference, Charlotte, N. C., March 20-24, 2016

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Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies

By Lajos Burgyan, et al, Power Pources Manufacturers’ Association, March, 2016, pp.  1-336

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Reverse Engineering for the Purpose of Intellectual Property Protection and  Accelerated Product Development of SOC and SIP Structures

By Lajos Burgyan; Yuji Kakizaki

International Microelectronics Assembly and Packaging Society, EEE Power Electronics Magazine, March 10-13, 2014.

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Revrese Engineering isn’t a Dirty Word

By Lajos Burgyan,

E-E Times, February 27, 2014.